2D Scanhead-30 serial
30 serial
Ho nepahala ha boemo bo phahameng.
Welding scanhead.
Pholiso ea metsi.
Moralo o motle oa cavity ea khatello.
Video ea Kopo
Tlhahisoleseding ea Theknoloji ea Sehlahisoa
| Litlhaloso tsa Optical | Boholo(mm) | 30 | |||
| lnput beam diameter(mm) | 30 | ||||
| Wavelength(nm) e teng | 355 | 980 | 1064 | 10640/9400 | |
| Optical Paramater | bokaholimo ba mahlo | 1/4 入@633 | |||
| optical Material | Si/SiC | ||||
| Litlhaloso tsa Galvanometer | Boima (KG) | 6 | |||
| Boholo(mm) | 199x145x142 | ||||
| Phetolelo | S30 | SH30 | SH30 P2 | ||
| Skena angle(°) | ±11 | ±11 | ±10 | ||
| Pheta-pheta (μrad) | 8 | 8 | 5 | ||
| Max.Gain Drift(ppm/k) | 150 | 100 | 50 | ||
| Max.Offset Drift(μrad/k) | 50 | 30 | 15 | ||
| Ho hoholeha ha nako e telele ho feta 8h(mrad) | ≤0.3 | ≤0.15 | ≤0.1 | ||
| Phoso ea ho Latela morao | <440 | <440 | <440 | ||
| Nako ea Karabelo ea Mohato 1% ea Sekala se Felletseng1 | <880 | <880 | <880 | ||
| Lebelo le Tloaelehileng la ho Tšoaea2 | 2 | 2 | 2 | ||
| Lebelo le Tloaelehileng la Positioning2 | 8 | 8 | 8 | ||
| Tšoaea Litlhaku tse Tloaelehileng3 | 350CPSBoleng bo Botle | 350CPSBoleng bo Botle | 350CPSBoleng bo Botle | ||
| 450CPSHo Ngola Hantle | 450CPSHo Ngola Hantle | 450CPSHo Ngola Hantle | |||
1) 1% mohato karabelo 2) 2D scanhead sebelisa F160 F-θ lense 3) F160 F-θ lense, 1mm bophahamo ba mola o le mong tlhaku, LenMark software & FEELTEK karete taolo
Sets'oants'o sa Mechini
FAQs
Nako ea tiisetso ke likhoeli tse 12 ho qala ka letsatsi la pelehi.
Optics, tšenyo e entsoeng ke motho kapa ka boomo ha e ka har'a sebaka sa tiisetso.
FEELTEK e ikemiseditse ho thekenoloji ya 3D laser dynamic focus mme e kentse letsoho ho kopanyelletsang mochini wa laser lefatsheng ka bophara.Joalo ka mofuputsi oa theknoloji e tsoetseng pele ea laser, FEELTEK le eona e sebelisa boikarabello ba khoebo sechabeng.
Selemo se seng le se seng, joalo ka karolo ea Lenaneo la Khoebo la Sechaba, FEELTEK e nka karolo ketsahalong ea mahlale e qaliloeng ke ofisi ea mahlale sekolong sa puo ea kantle ho naha.Re hasa theknoloji ea laser ho bacha ba lilemo tse 9 ho isa ho tse 12. Thepa ea 5G extension, 3D printing, le lisebelisoa tse ling tsa morao-rao tsa saense le theknoloji li khantšitse toro ea bacha ea saense le theknoloji.
